Company Profile

Company name
ELECTRONICS AND MATERIALS CORPORATION LIMITED
Location
Head office

15th Floor (Reception 16th Floor), Urban Net Midosuji Building,4-2-13 Awajimachi, Chuo Ward, Osaka City, Osaka 541-0047, Japan
TEL:06-6733-3868(代)FAX:03-4589-0558




Tokyo sales office

1-31-8 Takadanobaba, Shinjuku Ward, Tokyo 169-0075, Japan
TEL:03-5291-7070(代)FAX:03-5291-2825




Okayama sales office

Room 201, 2nd Floor, Topia Kasaoka Ekimae Building,36-1 Chuomachi, Kasaoka City, Okayama 714-0088, Japan
TEL:0865-62-6688(代)FAX:0865-62-6699


President
Shinichiro Saito
Foundation
December 2, 1981
Business
Sales of semiconductor materials,components, machines in Japan and imports/exports for sale.
Capital
JPY25,000,000
Number of employees
32
Shareholders
Kanematsu Corporation(100%)
兼松株式会社のロゴ
Correspondent financial institution
Mizuho Bank/Nada-branch,The bank of Tokyo-Mitsubishi UFJ/Nishinomiya-branch
Main Products
  • Ⅲ-Ⅴ compounds(GaAs、InP、GaSb、InAs、InSb etc.)
  • Ⅱ-Ⅵc ompoundsCdTe・ZnS・ZnTe etc.)
  • Silicon single crystal wafers
  • Silicon epitaxial wafers
  • High-Quality Compounds
  • Bonded SOI Wafer
  • Oxide single crystal wafers(MgO・STO・LiNbO3・LiTaO3・BGO・Al2O3 etc.)
  • Sputtering targets ( metal, oxide, compounds etc.)
  • High purity metal elements(Al、As、Ga、In、Be、Sn、Zn etc.)
  • Deposition materials (W. Mo boat type, ITO and the like)
  • High purity carbon jigs
  • MBE related jigs (Mo holder, K-cell gate valve and the like)

History of company

December, 1981
Established with capital of JPY 2,500,000
April, 1985
Increased capital to JPY 10,000,000
July, 1992
Increased capital to JPY 25,000,000
February, 2000
Established Tokyo sales office
August, 2004
Obtained ISO 14001 certification
December, 2005
Obtained ISO 9001 certification
March, 2008
Established Okayama sales office
January 2015
Established the Chiba Plant
May, 2025
100% subsidiary of Kanematsu Corporation
October 2025
Relocated the Head Office to the current address